UP-Microchip Packaging Cleanroom Renovation
DA Electrical

Bid Date / Prevailing Time
Project
UP-Microchip Packaging Cleanroom Renovation
Package Number
1.02
Awarded To
Top Ridge

Contact Dennis Walter ([email protected]) and Tina Petrie ([email protected]) for RFP Documents and Prequalification. 

All submissions shall be submitted electronically (.pdf) to Dennis Walter ([email protected]), Dave Sillner ([email protected]), Scott Erney ([email protected]), Julie Patrick ([email protected]), Jesse Wells ([email protected]), and Todd Webber ([email protected]).

Document Distribution
Document Cost
$0.00
Document Distribution Method
Via email
Anticipated Document Delivery