UP-Microchip Packaging Cleanroom Renovation

Project Number
Project Status
Architect/Engineer and Design/Build Selection
University Park
Project Stage
Appointment Complete
Project Description

The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.

Capital Project (>$10M)
Penn State Project Leader Name, Email