UP-Microchip Packaging Cleanroom Renovation

Project Number: 
Project Status: 
Design Professional Selection
Project Stage: 
Appointment Complete
Project Description: 

The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.

PSU Project Leader: 
RFP Due Date: 
Thursday, June 29, 2023 - 12:00pm
Response Date: 
Friday, June 2, 2023 - 12:00pm
Letter of Interest Due Date: 
Friday, June 2, 2023 - 12:00pm