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Microchip Packaging Cleanroom

Phase 1

Image
Microchip Packaging Cleanroom Rendering Penn State University

Status: Under Construction

Substantial Completion: October 2026

Location: Penn State University Park

Design: Stantec Architecture and Engineering LLC

Construction: Alexander Building Construction Co.

This project will enhance Penn State's capabilities and national preeminence in the critically important field of advanced semiconductor packaging. Phase 1 will expand and upgrade lab space and equipment to support current research and new collaborations. 

The project includes converting an existing lab and expanding the cleanroom at the Materials Research Institute (MRI) in the Millennium Science Complex for wet processing. Parts of the Electrical Engineering West building will also be updated to support dry packaging processes. 

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