Microchip Packaging Cleanroom
Phase 1
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Status: Under Construction
Substantial Completion: October 2026
Location: Penn State University Park
Design: Stantec Architecture and Engineering LLC
Construction: Alexander Building Construction Co.
This project will enhance Penn State's capabilities and national preeminence in the critically important field of advanced semiconductor packaging. Phase 1 will expand and upgrade lab space and equipment to support current research and new collaborations.
The project includes converting an existing lab and expanding the cleanroom at the Materials Research Institute (MRI) in the Millennium Science Complex for wet processing. Parts of the Electrical Engineering West building will also be updated to support dry packaging processes.